Feature
Parameter | Symbol | Value | Unit |
Power dissipation | Pd | 150 | mW |
Forward Current | If | 100 | mA |
Peak Forward Current | Ifp | 1000 | mA |
Reverse Voltage | Vr | 5 | V |
Lead Solder Temperature | Tsol | 260 for 5sec | ℃ |
Parameter | Symbol | Condition | Value | Unit |
Min. | Typ. | Max. |
Forward voltage | Vf | If=100mA | --- | 1.6 | 1.8 | V |
Radiant Intensity | Ie | If=100mA | 90 | 110 | --- | mW/Sr |
Peak wavelength | λp | If=100mA | --- | 850 | --- | nm |
Reverse current | Ir | Vr=5V | --- | --- | 50 | μA |
Dimension of 5mm 850nm ir round dip
Note:
1. All dimensions are in millimeters (mm);
2. X.X is +/-0.1mm,X.XX is +/- 0.05mm unless otherwise noted;
3. The device has a single mounting surface, the device must be mounted according to the specifications.
packaging
packaging details:500pcs/bag, anti-static electricity
Reliability Test Items and Conditions