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Guangdong Kingbali New Material Co., Ltd.
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1901b Series Two-component Epoxy Solvent Free Thermal Conductive Glue
1901b Series Two-component Epoxy Solvent Free Thermal Conductive Glue - Buy 1901b Series Thermal Conductive Glue,Two-component Glue,Two-component Epoxy Solvent Free Thermal Conductive Glue Product on Waimaotong.com
$0.05 />=Pieces
Product Details
Transaction Comments
- CAS No.
- 68891-59-7
- Other Names
- COB Bonding Glue
- MF
- C6H7NO2
- EINECS No.
- 210-898-8
- Place of Origin
- Guangdong China
- Classification
- Other Adhesives
- Main Raw Material
- adhesive glue
- Usage
- High Temperature COB/photovoltaic/semiconductor etc.
- Brand Name
- King Bali
- Model Number
- 1901B
- Type
- Thermal Conductive Glue
- Color
- White
- Name
- Thermal Conductive Glue
- Viscosity
- 300~400 Pa.S
- Mixing Ratio
- A:B=1:1(Volume)
- Thermal Conductivity(Before the Curing)
- 30W/m.k
- Operation
- 3~5Hrs(25 Degree)
- Cure Time Completely
- 13~30Hrs(15 Degree)
- Heat Deflection
- >120 Degree
- Dielectric Constant
- 2~4
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