Product Description
rolled copper foil for battery ,PCB,FPC,CCL,FCCL . width :5-620mm
Packaging & Shipping
1.Copper foil products Introduction
Item
| Name | Thickness(MM) | Standard Width(MM) | Max width(MM) | Application |
ED-copper foil | Battery copper | 0.006-0.018 | 1290 | 1380 | lithium battery,cell,mobile,phone |
FPC copper | 0.01-0.05 | 1290 | 1380 | FCCL,FPC,LED, |
PCB copper | 0.012-0.07 | 1290 | 1380 | PCB,Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.transformer lamination, electronic application, special cables |
V LP copper | 0.09-0.15 | 1290 | 1380 | Automotive, electrical, communications, military and other |
high-power circuit boards, high-frequency board |
manufacturing |
Shielding copper | 0.07-0.21 | 1290 | 1380 | Transformer,Cable, phone, cable, medical |
Waterproof copper | 0.012-0.07 | 1290 | 1380 | building |
Rolled copper | FPC copper | 0.012-0.07 | 520 | 620 | FCCL,FPC,LED |
Battery copper | 0.009-0.02 | 520 | 620 | lithium battery |
CuNiSi c opper7025 | 0.05-0.8 | 520 | 620 | such as all kinds of electric shock springs, connector |
assembly , connector and automotive small terminals. |
Bronze copper | 0.05-2.0 | 520 | 620 | Springs, switches, connectors, lead frames, connectors, |
terminal materials, the vibrating plate |
Beryllium copper | 0.01-0.15 | 520 | 620 | Connectors, springs, clamps, gaskets, cell phone batteries |
T2 copper | 0.05-2.0 | 520 | 620 | RF cable, vacuum electronic components, flexographic |
printing plate |
2. Technical Data Shee.
Thickness | mm | 0.009 | 0.012 | 0.018 | 0.025 | 0.035 | 0.05 | 0.07 | IPC 4562 4.6.3.1 |
Content | % | ≥99.95 | ≥99.95 | ≥99.95 | ≥99.95 | ≥99.95 | ≥99.95 | ≥99.95 | IPC 4562 4.6.3.2 |
Area weight | g/m² | 80±1 | 107±4 | 153±5 | 215±5 | 301±10 | 440±10 | 585±10 | IPC 4562 4.6.9 |
Roughness | (RA) | μm | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | IPC 4562 4.6.3.1 |
(RZ) | μm | ≤1.7 | ≤1.7 | ≤1.7 | ≤1.7 | ≤1.7 | ≤1.7 | ≤1.7 |
|
TS(MP) | state normal | Mpa | ≥360 | ≥380 | ≥390 | ≥400 | ≥400 | ≥400 | ≥410 | IPC 4562 4.6.4 |
State temper (180℃) | Mpa | ≥140 | ≥160 | ≥160 | ≥160 | ≥160 | ≥160 | ≥160 |
EI(%) | state normal | % | ≥1.2 | ≥1.4 | ≥1.5 | ≥1.6 | ≥1.7 | ≥1.7 | ≥1.8 | IPC 4562 3.5.3 |
state temper (180℃) | % | ≥6 | ≥8 | ≥10 | ≥10 | ≥12 | ≥13 | ≥14 |
Peel strength | N/mm | ≥1.0 | ≥1.2 | ≥1.3 | ≥1.4 | ≥1.5 | ≥1.6 | ≥1.7 | IPC 4562 4.6.7 |
High temperature oxidation resistance(180℃,60min) | - | standard | standard | standard | standard | standard | standard | standard | / |
solderability | - | standard | standard | standard | standard | standard | standard | standard | IPC 4562 4.6.12 |
etching | - | standard | standard | standard | standard | standard | standard | standard | IPC 4562 4.6.10 |
3.