1.All the Micro SD Card have 1 years warranty and competitive price
2.All the Micro SD Card are in stock!!!
3,All the Micro SD Card capacity is 100% real
4,Customize SD Card design and packing
5,offer ODM and OEM service.paypal and escrow
Specifications | Capacity | 128MB,256MB,512MB,1GB,2GB,4GB,8GB,16GB 32GB, 64GB |
Dimension | 0.59" x 0.43" x 0.039" ( 15mm*11mm*1mm )
|
Weight | 2.0 g |
Operating Temperature | -13°F to 185°F (-25°C to 85°C) |
Storage Temperature | -40°F to 185°F (-40°C to 85°C) |
Class | class4, class6, class10 |
Features | 1.Minimum 10 years data retension 2.High performance with high reading and writing speed 3.Data Endurance: 100k program/erase cysles 4.Ultra: portable,extremely samll footprint design 5.Write-protect switch prevents accidental data loss 6. Versatlile: combined with the inclued adapter, can be used as a full size SD card in enable-SD Device 7.Interoperable: with SD slot via SD adapter and with trans flash-enablued devices 8.Non-volatile fail-safe data storage( no external battery required ) 9.File Format FAT 32 10.Noise-free operation Packing : Blister Packing / Plastic Box Packing / Customized Packing |
Packaging & Shipping
Packing
1.Blister packing, Crytal packing,
2.Plastic bag, Pp box, tin box, paper box
3. As you require
Delivery
3-5 working days
Factory Information
Factory Size (Sq.meters): 3,000 square meters
Factory Location: Unit 705-6, 7/F, Lemmi Centre, 50 Hoi Yuen Road, Kwun Tong, Kowloon, Hong Kong
No. of Production Lines: 5
Number of R&D Staff: 30People
Number of QC Staff: 5 - 10 People
Contract Manufacturing: OEM Service Offered Design Service Offered Buyer Label Offered
Company Information
SHICHUANGYI(HK) electronics co., LTD. Is a high-tech enterprise mainly on semiconductor packaging test, in a flash memory data storage products research and development, manufacture and application development of the professional manufacturers, the company was founded in 2008, has focused on the semiconductor packaging and testing, for clients at home and abroad to provide storage chip testing and packaging, etc. A full set of solutions. The company is committed to high-end research and development of test data of memory chips, precision detection and needle for Flash Wafer card design, Flash controller software development.The company independently developed production SSD, Micro SD (T - Flash) card and U disk black colloid (UDP) full set of assembly process (Wafer Grind, Wafer Saw, Die Bond, Wire Bond, Molding, Jig Saw, Test, etc.).Technological process with advanced foreign advanced production equipment, development and production of SSD, eMMC, Micro SD (T - Flash), U disk, black colloid (UDP), ultra-thin plate load wafer encapsulation testing technology and Flash value-added application product development.Create the first-class semiconductor packaging test enterprise, to provide customers OEM/ODM services encapsulation testing, we create more value for customers.Collection of data storage research and development, manufacturing, marketing, services in a key high and new technology enterprise.