Item | Mass Production | Pilot Run Production |
Capacity | Capacity |
Layer Counts | 1L—18L, HDI | 20-28 , HDI |
Material | CME1,CME3,FR-4, High TG FR4 , Halogen-free FR4 , aluminium ,Ceramic(96% Alumina) |
Teflon,PTFE(F4B,F4BK), Rogers(4003,4350,5880)Taconic(TLX-8,TLX-9), Arlon(35N,85N)etc. |
Material Mixed Laminate | 4 layers -- 10 layers | 12 layers |
FR4+Ro4350 , FR4+Aluminium , FR4+ FPC |
Maximum Size | 610mm X 1200mm | 1200 - 2000MM |
Board Outline Tolerance | ±0.15mm | ±0.10mm |
Board Thickness | 0.125mm--6.00mm | 0.1mm--8.00mm |
Thickness Tolerance ( t≥0.8mm) | ± 8% | ±5% |
Thickness Tolerance( t<0.8mm) | ±10% | ±8% |
Minimum Line / Space | 0.10mm | 0.075mm |
Trace width Tolerance | 15%-20% | 10% |
Minimum Drilling Hole (Mechanical) | 0.2mm | 0.15mm |
Minimum laser hole | 0.1mm | 0.075mm |
Hole Position/hole Tolerance | ±0.05mm PTH:±0.076MM NPTH:±0.05mm |
Mini hole ring (single | 0.075MM | 0.05MM |
OutLayer Copper Thickness | 17um--175um | 175um--210um |
InnerLayer Copper Thickness | 17um--175um | 175um--210um |
Mini Solder Mask Bridge | 0.05mm | 0.025mm |
Impedance Control Tolerance | ±10% | ±5% |
Surface Finishing | HASL, Lead free HASL, Immersion gold, Immersion tin, Immersion Silver. |
Plated gold , OSP, Carbon ink, |
1-2L Lead-time | 3-7 days | 1-2 days |
4- 8L Lead-time | 7-10 days | 2-7 days |
10-18L Lead-time | 10-15 days | 4-9 days |
20-28L Lead-time | 15-20 days |
Acceptable File Format | ALL Gerber Files,POWERPCB,PROTEL,PADS2000,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 etc. |
Quality Standards | IPC-A-600F and MIL-STD-105D CHINA GB<4588>
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