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Article | Description | Capability |
Material | Laminate materials | FR4,Alu,CEM3,Taconic,Rogers |
Board cutting | Number of layers | 1-32 |
| Min. Thickness for inner layers (Cu thickness are excluded) | 0.003”(0.07mm) |
Board thickness | Standard | 0.04-0.16”±10%(0.1-4mm±10%) |
| Min. | Single/Double layer: 0.008±0.004” |
| | 4 layer: 0.01±0.008” |
| | 8 layer: 0.01±0.008” |
| Bow and twist | <7/1000 |
Copper weight | Outer Cu weight | 0.5-4 oz |
| Inner Cu weight | 0.5-3 oz |
Drilling | Min size | 0.0078” (0.2mm) |
| Drill deviation | ±0.002” (0.05mm) |
| PTH hole tolerance | ±0.002” (0.005mm) |
| NPTH hole tolerance | ±0.002” (0.005mm) |
Plating | Min hole size | 0.0008” (0.02mm) |
| Aspect ratio | 20 (5:1) |
Solder mask | Color | Green,white,black,red,yellow,blue... |
| Min solder mask clearanace | 0.003” (0.07mm) |
| Thickness | 0.0005-0.0007”(0.012-0.017mm) |
Silkscreen | Color | White,black,yellow,red,blue... |
| Min size | 0.006” (0.15mm) |
E-test | Flying Probe Tester | Y |
Controlled Impedance | Tolerance | ±10% |
| Impedance tester | Tektronix TDS8200 |
Surface Finish | HASL,ENIG,immersion silver,immersion tin,OSP... |
PCBA capacity