Layer count

1-36 layers

Min line width/space

3mil/3mil

Mim Mechanical drilling hole size

Board thickness≤1.2mm  0.15mm

Board thickness≤2.5mm  0.2mm

Board thickness>1.2mm  Aspect ratio≤15:1

Finished board thickness

Max: 10mm

Min: 2 layers-0.2mm; 4 layers-0.35mm; 6 layers-0.55mm;

8layers-0.7mm, 10layers-0.9mm

Finished copper thiciness

Inner layer/outer layer:6oz/10oz

Max panel size

610*1200mm

Impedeance Tolerance

±10%

Min Dielectric thickness

2mil

Type of dielectric meterial 

FR4,high TG,Flex,rigid,rigid-flex, Halogen Free material,Aluminum based material,Copper based material,High frequency material,PTFE material,heavy copperfoil,paperphenolic plate,BT,PI,Composite material,PTFE+ metal based

Major Material supplier

FR4:Shengyi,ITEQ,Isola,KB,Arlon

PTFE:Rogers,Taconic,Nelco,Wangling,

Metal based meterial:Bergquist,Laird,Totking,ITEQ,Arlon,

Soldermask colour

green,red,blue,white,black,yellow

Surface treatment

HASL ,immsersion gold,immersion silver,OSP,gold finger

Special process

Multilayer PCB with blind or buried vias, impedance control

Quality control

AOI,100% electronic test

Mount range

0201,0402,0603.0805,1206,1210.chips,QFN,QFP,BGA,LGA,DSP,CSP assembly;through hole parts assembly

Mount Accuracy

±0.05MM

Max PCB size

Sample:400*800mm;Volume 350*550mm

Max components height

25.4mm

Min pitch for QPF/SOP/SOJ/IC

0.3mm

Min pitch for GSP/BGA

0.3mm

Assembly

• Surface mount, through hole, BGA, QFP 
• Component procurement 
• Build one sample first for customer validation 
• ROHS compliant and lead-free process 
• Wire & cable assembly 
• OAI and functional test 
• Full system test 
• Turnkey manufacturing

 Test

  AOI,eyes testing,function test,temperature cycling