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Ultrafine Copper Silver Alloy Powder
Ultrafine Copper Silver Alloy Powder , Find Complete Details about Ultrafine Copper Silver Alloy Powder,Copper Powder,High Quality Copper Silver Alloy Powder,Nano Cuag Powder from Copper Powder Supplier or Manufacturer-Shanghai Ruizheng Chemical Technology Co., Ltd.
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Ultrafine Copper Powder
Ultrafine CuAg Alloy Powder
Ultrafine CuNi Alloy Powder
Ultrafine Copper Powder
Applications:Efficient catalysts: The large and highly active surface area, ultrafine copper has a greatly enhancement catalytic efficiency. Instead of conventional micro copper, ultrafine copper powder can be used for methanol industry.
Conductive paste: Electronic paste is widely used in micro-electronics industry packaging, connectivity, miniaturization of microelectronic devices. ultrafine copper electronic paste has superior performance as micro copper. It is widely used in MLCC.
Sintering additives: ultrafine copper powder has large volume ratio of surface atoms, which have so high energy state. In the powder metallurgical industry, it can be used as sintering additive to reduce sintering temperature in production of ceramic and diamond tools .
Medicine and anti bacteria: ultrafine copper powder can be used widely in medical industry and to anti bacteria.
Lubricant addictive: ultrafine copper powder can be dispersed into lubricant to decrease the surface friction and repair micro defects of the friction surface.
Specification | particle size (m) | specific surface area (m2/g) | Laser Particle SizePSA(m) | Tap density (g/cm3) | ||
D10 | D50 | D90 | ||||
Cu-01 | 0.30 | 1.69-2.69 | 0.50 | 1.00 | 1.80 | 2.60 |
Cu-02 | 0.50 | 1.10-1.70 | 1.20 | 1.50 | 3.50 | 3.00 |
Cu-03 | 1.00 | 0.50-1.00 | 1.50 | 2.50 | 5.50 | 3.50 |
Ultrafine CuAg Alloy Powder
Application:Be extensively applied to conductive adhesive, conductive coating, polymer paste, micro electronic technique field with demand for conduction and static conduction, electromagnetic shielding, and non-conductive material surface metallization treatment
Specification | Particle Size(m) | Specific Surface Area (m2/g) |
| Silver Content (wt%) | |||
D10 | D50 | D90 | |||||
CuAg-01 | 0.50 | 1.05-1.70 | 0.80-1.80 | 1.05-1.45 | 2.80-3.30 | 30 | |
CuAg-02 | 1.00 | 0.90-1.10 | 2.10-2.60 | 3.10-3.60 | 5.20-5.80 | 30 | |
CuAg-03 | 5.0 | 0.25-0.30 | 3.30-3.80 | 5.40-6.30 | 8.80-10.30 | 15 | |
CuAg-04 | 1.90-2.00 | 1.50-1.70 | 3.00-3.50 | 5.00-5.60 | 30 | ||
CuAg-05 | 0.80-0.95 | 2.50-3.20 | 3.80-4.11 | 5.80-6.30 | 30 | ||
CuAg-06 | 0.35-0.60 | 3.20-3.80 | 5.40-6.30 | 8.80-10.30 | 20 | ||
Ultrafine CuNi Alloy Powder
Applications:Be applied to thetermination and internal electrode of multi-Layered Ceramic Capacitors ,as well as the slurry of other electronic components.
Specification | Mean particle size (m) | Specific Surface area (m2/g) | Tap Desity (g/3) | Ni content(%) |
CuNi-01 | 0.50 | 1.04-1.69 | 3.00 | 10,20,30 |
CuNi-02 | 1.00 | 0.56-0.90 | 3.50 | ,10,20,30 |
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