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Shenzhen Hansion Technology Co., Ltd.
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Top quality ENIG FR4 multilayer pcb factory in China
OverviewQuick DetailsPlace of Origin:Guangdong, China (Mainland)Brand Name:HSModel Number:HSFR4 multilayer pcb factoryNumber of Layers:4-Lay
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Top quality ENIG FR4 multilayer pcb factory in China
We can do for you:
♦ 1—12 layer FR4 PCB,1 layer Aluminum PCB,1-4 layer Flexible PCB.
♦ 1—3oz copper thickness.
♦ 0.2mm hole size.
♦ 0.1mm track width/space.
♦ SMT PCBA service.
FAQ:
Q:1.Can i have a sample to test?
A:Yes,we can send you samples to test.
Q:2.What specifications do you need for PCB quotation?
A:We need your PCB Gerber file,board thickness,copper thickness,surface finishing and quantity to quote you.
Q:3.What is the lead time?
A:Samples need 3-5days,mass production needs 7-10days,also according to the order volume.
Q:4.Do you have MOQ limit?
A:Even 1 pcs,we care.
Q:5.Can you offer the best price for us?
A:Yes,we are specialized PCB manufacturer directly,we can offer lower price than any trading company.
Q:6.How do you ship the goods and how long does it take arrival?
A:We usually ship by DHL,UPS,FedEx and TNT.It takes 3-5days to arrive.
Q:7.What are the payment terms?
A:You can pay us with Paypal,Western Union and T/T Bank.
Q:8.Can we visit your factory?
A:Yes,welcome to visit our factory anytime,and we will lead you to visit our factory and our production line.
Manufacturing Capability:
item
| Manufacture Capability
|
Material
| FR4,CEM-1, Aluminium, Polyamide
|
Layer No.
| 1-12
|
Finished board thickness
| 0.1 mm-4.0mm
|
Board Thickness Tolerance
| ±10%
|
Cooper thickness
| 0.5 OZ-3OZ (18 um-385 um)
|
Copper Plating Hole
| 18-40 um
|
Impedance Control
| ±10%
|
Warp&Twist
| 0.70%
|
Peelable
| 0.012"(0.3mm)-0.02’(0.5mm)
|
Images
| |
Min Trace Width (a)
| 0.075mm (3mil)
|
Min Space Width (b)
| 0.1mm (4 mil)
|
Min Annular Ring
| 0.1mm (4 mil)
|
SMD Pitch (a)
| 0.2 mm(8 mil)
|
BGA Pitch (b)
| 0.2 mm (8 mil)
|
Solder Mask
| |
Min Solder Mask Dam (a)
| 0.0635 mm (2.5mil)
|
Solder mask Clearance (b)
| 0.1mm (4 mil)
|
Min SMT Pad spacing (c)
| 0.1mm (4 mil)
|
Solder Mask Thickness
| 0.0007"(0.018mm)
|
Holes
| |
Min Hole size (CNC)
| 0.2 mm (8 mil)
|
Min Punch Hole Size
| 0.9 mm (35 mil)
|
Hole Size Tol (+/-) | PTH:±0.075mm;NPTH: ±0.05mm |
Hole Position Tol | ±0.075mm
|
Plating
| |
HASL
| 2.5um
|
Lead free HASL | 2.5um
|
Immersion Gold
| Nickel 3-7um Au:1-5u''
|
OSP
| 0.2-0.5um
|
Outline
| |
Panel Outline Tol (+/-)
| CNC: ±0.125mm, Punching: ±0.15mm
|
Beveling
| 30°45°
|
Gold Finger angle
| 15° 30° 45° 60°
|
Certificate | ROHS, ISO9001:2008, SGS, UL certificate |
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