Industrial Brush
Civilian Brush
Brush Equipment
Brush Raw Materials
Decoration Materials
∨
∧
Number of Layer | 1,2,4 or 6,upto 18 layer |
Order Quantity | 1 to 50,000 |
Board Shape | Retangular,round,slots,cutouts,complex,irregular |
Board Type | Rigid, Flexible, Rigid-flexible |
Board Material | FR-4 glass epoxy, FR-4 high Tg, Rohs compliant,Aluminum,Rogers,etc. |
Board Cutting | Shear,V-score,Tab-routed |
Board Thickness | 0.2-4.0mm, Flex 0.01-0.25mm |
Copper Weight | 1.0, 1.5, 2.0 oz |
Solder Mask | Double-sided green LPI,Also support Red,White,Yellow,Blue,Black |
Silk Screen | Double-sided or single-sided in white,yellow,black,or negative |
Silk Screen Min Line Width | 0.006'' or 0.15mm |
Max Board Dimensions | 20 inch*20inch or 500mm*500mm |
Min Trace/Gap | 0.10mm, or 4mils |
Min Drill Hole Diameter | 0.01'',0.25mm, or 10mils |
Surface Finish | HASL,Nickle,Immersion Gold,Immersion Tin,Immersion Silver,OSP,etc. |
Board Thickness Tolerance | ±10% |
Copper Weight Tolerance | ± 0.25 oz |
Minimal Slot Width | 0.12'', 3.0mm, or 120mils |
V-Score Depth | 20-25% of board thickness |
Design File Formate | Gerber RS-274,274D,Eagle and AutoCAD's DXF,DWG |
Quantity |
Prototype&Low Volume PCB Assembly,from 1 Board to 250,is specialty,or up to 1000 |
Type of Assembly | SMT,Thru-hole |
Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free |
Components |
Passive Down to 0201 size BGA and VFBGA Leadless Chip Carriers/CSP Double-sided SMT Assembly Fine Pitch to 0.8mils BGA Repair and Reball Part Removal and Replacement |
Bare Board Size |
Smallest:0.25*0.25 inches Largest:20*20 inches |
File Formate |
Bill of Materials Gerber files Pick-N-Place file |
Types of Service |
Turn-key,partial turn-key or consignment |
Component packaging | Cut Tape,Tube,Reels,Loose Parts |
Turn Time | Same day service to 15 days service |
Testing | Flying Probe Test,X-ray Inspection AOI Test |
PCB assembly process |
Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing |