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Printed Circuit Board PCB Manufacturer Over 15 Years
Basic Info Model NO.: pcb0993
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Basic Info
  • Model NO.: pcb0993
  • Dielectric: CEM-3
  • Application: Consumer Electronics
  • Processing Technology: Electrolytic Foil
  • Base Material: Copper
  • Brand: LX
  • Cooper Thickness: 11oz (18 Um-385 Um)
  • Certificate: RoHS, ISO9001:2008, SGS, UL Certificate
  • Color: White
  • Export: Japan
  • Specification: UL, ROHS, REACH, SGS, TS16949, ISO14000
  • Structure: Double-Sided Rigid PCB
  • Material: Epoxide Woven Glass Fabric Laminate
  • Flame Retardant Properties: V0
  • Production Process: Additive Process
  • Insulation Materials: Organic Resin
  • Layer No.: 1 Layer
  • Finished Board Thickness: 0.2 5mm
  • Laminate Materials: Fr-4,Fr-1,,Fr-2,Cem-1,Cem-3
  • Size: 233*250mm
  • Trademark: HRSC
  • Origin: Dongguan
Product Description
                                                           Wellcome to HRSCPCB


We are the Printed Circuit Boards(PCB) manufacturer with 15 years experience, specialized in single-sided, 2-layerd, multilayer and high density interconnector (HDI) PCB.Japanese management ,One-Stop  PCB &pcb assembly & pcb design for you.

Certification: UL, ISO14001, ISO9001, SGS, TS16949
Used for auto industry, high power led, electric toy, machinery, industrial lighting and so on.

Our process capability
Description Capability
PCB Surface Finishes electrolytic nickel-gold,
HASL(Lead Free, ENIG (Electroless Nickel/Immersion Gold, Carbon Ink, Golden Fingers, OSP (Entek, Immersion Tin, Immersion Silver
PCB Board Max. Size 1200mm×600mm
PCB Board Min. Size 5mm×5 mm
Bow & Twist Tolerance Single Side≤1.0%,Double Side≤0.7%, Muti-Layer≤0.5%
Min. Board Thickness & Tolerance 0.2mm±0.08mm
Min. trace/spacing Tin board:0.2mm±20%(8mil±0%)
gold board:0.075mm±20%(3mil±0%)
Copper to Board Edge Spacing 0.5mm(20mil)
Hole to Trace Spacing 0.3mm(12mil)
Min. Hole Diameter 0.2mm±.076mm(8mil±3mil)
Min. Hole Clearance 0.4mm±.076mm(16mil±3mil)
Copper Thickness on Hole Wall 20-25um(0.79mil-1.0mil)
Hole Location Tolerance ±0.076mm(l±3mil)
Min Diameter of Punching Hole FR-4 board thickness≤1.0mm(40mil):1.0mm(40mil)
FR-4 board thickness 1.2-3.0mm(48-120mil):1.5mm(60mil)
Min. Punching Slot FR-4 CEM-3 board thickness≤1. 0mm(40mil):0.8 mm×0.8 mm(32mil×32mil)
FR-4 board thickness1.2-3.0mm(48-120mil): 1.0 mm×1.0 mm(40mil×40mil)
Trace width variation ±0.076mm(±3mil)
Outline Tolerance Routing:±0.1mm (±4mil)  ,Punching:±0.05mm (±2mil)
V-CUT Registration Tolerance±0.2mm (±8mil)
Type Single-sided, double-sided, multi-layer
Major Material FR-4, CEM-1,CEM-3, high frequency laminates, Aluminum, NiFe-based, copper base
Thickness 0.2-3.5mm
Base Copper Thickness 11um  35um  70um  105um
Max. aspect ratio(board thickness: hole size) 8:1
V-Cut Angle Tolerance ±5°
V-Cut Board Thickness 0.4mm -3.2mm(16mil -128mil)
Min SMT Pitch 0.3mm(12mil)
Min. Component mark 0.15mm(6mil)
Min. width of annular ring(finished) 0.15mm(6mil)/side
Min pad opening 0.076mm(3mil)
Min S/M Bridge ±0.076mm(±3mil)
carbon ink board manufacturing capability:1.Impedance Control:20K±10%  2.Hardness:6H  3.bearable friction times :above 200000 times
What we need:
Please tell us the information as below:
Board for what product Surface Finish
Number of Layers Board Material
Copper Thickness(um) Board Thickness(um)
Solder Mask Color PCB Dimensions(mm)
Silk Screen Color Min Finished Hole Size(mm)
Milling Min Clearance(mm)
Min Track Width(mm) Other special requirements

Fast delivery:
Packaging Vacuum Packing with desiccant,
Professional Export Carton.




Delivery
time

Prototype    Mass production
(above 30m)
2L Quick turn:24h
Usual time:3-4days
5-10days
4L Quick turn:48 hours;
Usual time:5-6days
8-15days
6L Quick turn:72 hours;
Usual time:6-8days
10-16days
8L Quick turn:72 hours;
Usual time:8-10days
16-18days
10L Quick turn:96 hours;
Usual time:12-14days
18-25days
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Please send us your Gerber Files and PCB specifications; we will quote for you within 12 hours.

We always try our best! So we do, we conquer, and we get there!

Contact us!!
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