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BICHENG ENTERPRISE LIMITED
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ChinaVIP0Audited Supplier
Products: PCB , High Frequency PCB , Metal Core PCB , Aluminum PCB , Prototype PCB , Multilayer PCB , Flexible Printed Circuit FPC , Double Sided PCB , SMT Stencil , PCB Assembly
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PCB Connector PCB Board Multilayer PCB Immersion Gold 2.0mm
Basic Info
Model NO.: BIC1332R3.8
$0 /Piece
Product Details
Transaction Comments
Basic Info
- Model NO.: BIC1332R3.8
- Dielectric: FR-4
- Application: Consumer Electronics
- Mechanical Rigid: Rigid
- Base Material: Copper
- Surface Finish: Immersion Gold
- Surface Cu Thickness: 1oz
- Number of Solder Masks: 2
- Color of Silkscreen: White
- Transport Package: Vacuum
- Origin: China
- Type: Rigid Circuit Board
- Material: Fiberglass Epoxy
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
- Insulation Materials: Epoxy Resin
- Inner Iayer Cu Thicknes: 1 Oz
- Solder Mask Colour: Green
- Thickness of Solder Mask: 13 Um
- Trademark: bicheng enterprise limited
- Specification: 213.58
- HS Code: 8534001000
Product Description
PCB Connector PCB board Multilayer PCB Immersion Gold 2.0mm
Commodity Introduction
This is a type of FR-4 PCB for the application of CODEC. It's a 4 layer board at 2.0mm thick. The base laminate is from ITEQ, Solder mask and silkscreen from Taiyo. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards or panels are packed separately.
Parameter & Data Sheet
Laminates --- FR-4 Applied on printed circuit boards (PCBs)
FR-4 grade materials are generally used on the circuit board has many types, but most are based on the so-called four function (Tera-Function) composite material which is composed of woven fiberglass cloth with an epoxy resin binder that is flame resistant.
FR-4 is the primary insulating backbone upon which the vast majority of rigid printed circuit boards (PCBs) are produced. A thin layer of copper foil is laminated to one or both sides of an FR-4 glass epoxy panel. These are commonly referred to as copper clad laminates (CCL).
FR-4 copper-clad sheets are fabricated with circuitry interconnections etched into copper layers to produce printed circuit boards (PCBs). More sophisticated and complex FR-4 printed circuit boards (PCBs) are produced in multiple layers, also known as "multilayer circuitry".
Commodity Introduction
This is a type of FR-4 PCB for the application of CODEC. It's a 4 layer board at 2.0mm thick. The base laminate is from ITEQ, Solder mask and silkscreen from Taiyo. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards or panels are packed separately.
Parameter & Data Sheet
| Number of Layers | 4 |
| Board Type | Multilayer PCB, 4 Layers |
| Board Thickness | 2.0mm +/-0.2 |
| Board Material | FR-4 |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 135ºC |
| PTH Cu thickness | ≥20 um |
| Inner Iayer Cu thicknes | 35 um (1oz) |
| Surface Cu thickness | 35 um (1oz) |
| Solder Mask Type and Model No. | LPSM, PSR-2000GT600D |
| Solder Mask Supplier | TAIYO |
| Solder Mask Colour | Green |
| Number of Solder Masks | 2 |
| Thickness of Solder Mask | 13um |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | Whie |
| Number of Silkscreen | 1 |
| Mininum Trace (mil) | 7 mil |
| Minimum Gap(mil) | 5 mil |
| Surface Finish | Immersion gold, 0.05 micron gold over 4.13 micron nickel |
| RoHS Required | Yes |
| Warpage | 0.23% |
| Thermal Shock Test | Pass, 288±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
| Solderablity Test | Pass, 255±5ºC,5 seconds Wetting Area Least 95% |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6012C Class 2 |
Laminates --- FR-4 Applied on printed circuit boards (PCBs)
FR-4 grade materials are generally used on the circuit board has many types, but most are based on the so-called four function (Tera-Function) composite material which is composed of woven fiberglass cloth with an epoxy resin binder that is flame resistant.
FR-4 is the primary insulating backbone upon which the vast majority of rigid printed circuit boards (PCBs) are produced. A thin layer of copper foil is laminated to one or both sides of an FR-4 glass epoxy panel. These are commonly referred to as copper clad laminates (CCL).
FR-4 copper-clad sheets are fabricated with circuitry interconnections etched into copper layers to produce printed circuit boards (PCBs). More sophisticated and complex FR-4 printed circuit boards (PCBs) are produced in multiple layers, also known as "multilayer circuitry".
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