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Shenzhen Hansion Technology Co., Ltd.
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PCB /PCBA design,bom gerber files multilayer PCB,prototype PCB
OverviewQuick DetailsPlace of Origin:Guangdong, China (Mainland)Brand Name:HSModel Number:CustomizedBase Material:FR4 Aluminum CEM-1 94V0Cop
$0 /SquareMeter
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PCB /PCBA design,bom gerber files multilayer PCB,prototype PCB
We can do for you:
♦ 1-12 layer FR4 PCB.
♦ 1-2layer aluminum PCB.
♦ 1-4layer flexible PCB.
♦ CEM-1 PCB
♦ 94VO PCB
♦ SMT and DIP assembly service.
FAQ:
Q:1.Can i have a sample to test?
A:Yes,we can send you samples to test.
Q:2.What specifications do you need for PCB quotation?
A:We need your PCB Gerber file,board thickness,copper thickness,surface finishing and quantity to quote you.
Q:3.What is the lead time?
A:Samples need 3-5days,mass production needs 7-10days,also according to the order volume.
Q:4.Do you have MOQ limit?
A:Even 1 pcs,we care.
Q:5.Can you offer the best price for us?
A:Yes,we are specialized PCB manufacturer directly,we can offer lower price than any trading company.
Q:6.How do you ship the goods and how long does it take arrival?
A:We usually ship by DHL,UPS,FedEx and TNT.It takes 3-5days to arrive.
Q:7.What are the payment terms?
A:You can pay us with Paypal,Western Union and T/T Bank.
Q:8.Can we visit your factory?
A:Yes,welcome to visit our factory anytime,and we will lead you to visit our factory and our production line.
Manufacturing Capability:
item | Manufacture Capability |
Material | FR4,CEM-1, Aluminium, Polyamide |
Layer No. | 1-12 |
Finished board thickness | 0.1 mm-4.0mm |
Board Thickness Tolerance | ±10% |
Cooper thickness | 0.5 OZ-3OZ (18 um-385 um) |
Copper Plating Hole | 18-40 um |
Impedance Control | ±10% |
Warp&Twist | 0.70% |
Peelable | 0.012"(0.3mm)-0.02’(0.5mm) |
Images | |
Min Trace Width (a) | 0.075mm (3mil) |
Min Space Width (b) | 0.1mm (4 mil) |
Min Annular Ring | 0.1mm (4 mil) |
SMD Pitch (a) | 0.2 mm(8 mil) |
BGA Pitch (b) | 0.2 mm (8 mil) |
Solder Mask | |
Min Solder Mask Dam (a) | 0.0635 mm (2.5mil) |
Solder mask Clearance (b) | 0.1mm (4 mil) |
Min SMT Pad spacing (c) | 0.1mm (4 mil) |
Solder Mask Thickness | 0.0007"(0.018mm) |
Holes | |
Min Hole size (CNC) | 0.2 mm (8 mil) |
Min Punch Hole Size | 0.9 mm (35 mil) |
Hole Size Tol (+/-) | PTH:±0.075mm;NPTH: ±0.05mm |
Hole Position Tol | ±0.075mm |
Plating | |
HASL | 2.5um |
Lead free HASL | 2.5um |
Immersion Gold | Nickel 3-7um Au:1-5u'' |
OSP | 0.2-0.5um |
Outline | |
Panel Outline Tol (+/-) | CNC: ±0.125mm, Punching: ±0.15mm |
Beveling | 30°45° |
Gold Finger angle | 15° 30° 45° 60° |
Certificate | ROHS, ISO9001:2008, SGS, UL certificate |
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