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Products: PCB , High Frequency PCB , Metal Core PCB , Aluminum PCB , Prototype PCB , Multilayer PCB , Flexible Printed Circuit FPC , Double Sided PCB , SMT Stencil , PCB Assembly
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Multilayer PCB 4layer Blue Soldermask with Immersion Gold
Basic Info
Model NO.: BIC-259-V2.59
$0 /Piece
Product Details
Transaction Comments
Basic Info
- Model NO.: BIC-259-V2.59
- Dielectric: FR-4
- Application: Consumer Electronics
- Mechanical Rigid: Rigid
- Base Material: Copper
- Finished Thickness: 1.68 mm
- Inner Layer Cu Thickness: 1/1 Oz
- Surface Treatment: Enig
- Legend: White,Tai Yo,S-380W
- Spacing (mm): 0.186 mm
- Trademark: Bicheng Enterprise Limited
- Specification: 2003.72x 185.20mm=10PCS
- HS Code: 8534009000
- Type: Rigid Circuit Board
- Material: Fiberglass Epoxy
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
- Insulation Materials: Epoxy Resin
- Pth Cu Thickness: 25.67um
- Surface Cu Thickness: 47.60 Um
- Solder Mask: Matt Blue,Kuang Shun,Ksm-6189blm1
- Trace Width (mm): 0.207mm
- Warp and Twist: 0.21%
- Transport Package: Vacuum
- Origin: China
Product Description
Tg135 FR-4 Multilayer 4 Layer PCB 1.68mm Thick with Matt Blue and Immersion Gold in Alarm Systems
Commodity Introduction
This is a type of FR-4 PCB for the application of Alarm Systems. It's a 4 layer board at 1.6mm thick.The base laminate is from ShengYi, Solder mask and silkscreen from KUANG SHUN and Taiyo. It's fabricated per IPC
6012 Class 2 using supplied Gerber data. Each 10 boards or panels are packed separately.
Parameters & Data Sheet
Finished dimension (unit: mm): including v-cut
Hole size and slot dimension(unit: mm, PTH tolerance +/-0.076, NPTH +/-0.05mm)
Learn PCB and Buy PCB
Glass Transition Temperature (Tg)
The thermal properties of the resin system are characterized by the glass transition temperature (Tg), which always is expressed in °C. The most commonly used property is the thermal expansion. When measuring the expansion versus the temperature, we can get a curve as shown in following picture. The Tg is determined by
the intersection of the tangents of the flat and steep parts of the expansion curve. Below the glass transition temperature, the epoxy resin is rigid and glassy. When the glass transition temperature is exceeded, it changes
to a soft and rubbery state.
For the most commonly used types of epoxy resin (FR-4 grade), the glass transition temperature is in the range 115-130°C, so when the board is soldered, the glass transition temperature is easily exceeded. The board expands in the Z-axis direction and stresses the copper of the hole wall. The expansion of epoxy resin is about 15 to 20 times greater than that of copper when exceeding Tg. This implies a certain risk of wall cracking in plated-through holes, and the more resin around the hole wall, the greater risk. Below the glass transition temperature, the expansion ratio between epoxy and copper is only three times, so here the risk of cracking is negligible.
Commodity Introduction
This is a type of FR-4 PCB for the application of Alarm Systems. It's a 4 layer board at 1.6mm thick.The base laminate is from ShengYi, Solder mask and silkscreen from KUANG SHUN and Taiyo. It's fabricated per IPC
6012 Class 2 using supplied Gerber data. Each 10 boards or panels are packed separately.
Parameters & Data Sheet
| Item | Description | Requirement | Actual | |
| Laminate | Laminate Type | FR4:CTI:175V-249V | FR4:CTI:175V-249V | |
| Supplier | SHENGYI | SHENGYI | ||
| Tg | TG >135 | TG >135 | ||
| Finished thickness | 1.6+/--0.16 MM | 1.68 MM | ||
| Plating thickness | PTH Cu thickness | 23 um | 25.67um | |
| Inner layer Cu Thickness | 1/1 OZ | 1/1 OZ | ||
| Surface Cu thickness | 35 um | 47.60 um | ||
| Solder Mask | Material type | KSM-6189BLM1 | KSM-6189BLM1 | |
| Supplier | KUANG SHUN | KUANG SHUN | ||
| Color | Matt blue | Matt blue | ||
| Single / both sides | Both Sides | Both Sides | ||
| S/M thickness | >= 10.0 um | 26.7 um | ||
| 3M tape test | NO Peel Off | No peel off | ||
| Legend | Material type | S-380W | S-380w | |
| Supplier | Tai yo | Tai yo | ||
| Color | White | White | ||
| Location | Both Sides | Both Sides | ||
| 3M tape test | No peel off | no peel off | ||
| Circuit | Trace Width (mm) | 0.20+/-20%mm | 0.207mm | |
| Spacing (mm) | 0.19+/- 20%mm | 0.186 mm | ||
| Identification | UL mark | As requirement | OK | |
| Company Logo | As requirement | OK | ||
| Date code | WWYY | WWYY | ||
| Mark location | CS | CS | ||
| Surface Treatment | ENIG | Nickel | 100u" | 113u" |
| Gold | 4u" | 4.11u" | ||
| Reliabilty Tests | Thermal shock test | 288±5ºC,10sec, 3 cycles |
NO Discolor, NO Delamination |
|
| solder abllity test | 235±5ºC | 100% Wetting | ||
| Function | Electrioal Test | 100% | pass | |
| Standard | IPC-A 600H class 2, IPC_6012C CLASS 2 |
100% | Pass | |
| Appearance | Visual inspection | 100% | Pass | |
| warp and twist | <= 0.75% | 0.21% | ||
| Others | V-Cut thickness | 0.4±0.1 mm | 0.39mm | |
| Angle | 30+/- 5 | 30º | ||
Finished dimension (unit: mm): including v-cut
| No | Required | Actual Dimension | ||||
| 1 | 203.720 | 203.660 | 203.590 | 203.590 | 203.590 | 203.690 |
| 2 | 185.200 | 185.130 | 185.070 | 185.070 | 185.170 | 185.170 |
Hole size and slot dimension(unit: mm, PTH tolerance +/-0.076, NPTH +/-0.05mm)
| No | Required | PTH/NPTH | Actual Dimension | |||
| 1 | 0.300 | Y | VIA | VIA | VIA | VIA |
| 2 | 0.900 | Y | 0.975 | 0.875 | 0.090 | 0.975 |
| 3 | 1.000 | Y | 1.000 | 1.075 | 1.025 | 1.000 |
| 4 | 1.100 | Y | 1.025 | 1.100 | 1.050 | 1.150 |
| 5 | 1.998 | N | 2.025 | 1.950 | 1.950 | 2.000 |
| 6 | 2.200 | N | 2.200 | 2.250 | 2.250 | 2.250 |
| 7 | 2.400 | Y | 2.450 | 2.400 | 2.375 | 2.375 |
| 8 | 3.300 | N | 3.535 | 3.325 | 3.325 | 3.325 |
Learn PCB and Buy PCB
Glass Transition Temperature (Tg)
The thermal properties of the resin system are characterized by the glass transition temperature (Tg), which always is expressed in °C. The most commonly used property is the thermal expansion. When measuring the expansion versus the temperature, we can get a curve as shown in following picture. The Tg is determined by
the intersection of the tangents of the flat and steep parts of the expansion curve. Below the glass transition temperature, the epoxy resin is rigid and glassy. When the glass transition temperature is exceeded, it changes
to a soft and rubbery state.
For the most commonly used types of epoxy resin (FR-4 grade), the glass transition temperature is in the range 115-130°C, so when the board is soldered, the glass transition temperature is easily exceeded. The board expands in the Z-axis direction and stresses the copper of the hole wall. The expansion of epoxy resin is about 15 to 20 times greater than that of copper when exceeding Tg. This implies a certain risk of wall cracking in plated-through holes, and the more resin around the hole wall, the greater risk. Below the glass transition temperature, the expansion ratio between epoxy and copper is only three times, so here the risk of cracking is negligible.
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