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PCB Description | Our PCB Board Capability |
PCB Surface Finishes | electrolytic nickel-gold, HASL(Lead Free, ENIG (Electroless Nickel/Immersion Gold, Carbon Ink, Golden Fingers, OSP (Entek, Immersion Tin, Immersion Silver |
PCB Max. Size | 1200mm×600mm |
PCB Min. Size | 5mm×5 mm |
Bow & Twist Tolerance | Single Side≤1.0%,Double Side≤0.7%, Muti-Layer≤0.5% |
Min. Board Thickness & Tolerance | 0.2mm±0.08mm |
PCB Min. trace/spacing | Tin board:0.2mm±20%(8mil±0%) |
gold board:0.075mm±20%(3mil±0%) | |
Copper to Board Edge Spacing | 0.5mm(20mil) |
Hole to Trace Spacing | 0.3mm(12mil) |
Min. Hole Diameter | 0.2mm±.076mm(8mil±3mil) |
Min. Hole Clearance | 0.4mm±.076mm(16mil±3mil) |
Copper Thickness on Hole Wall | 20-25um(0.79mil-1.0mil) |
Hole Location Tolerance | ±0.076mm(l±3mil) |
Min Diameter of Punching Hole | FR-4 board thickness≤1.0mm(40mil):1.0mm(40mil) |
FR-4 board thickness 1.2-3.0mm(48-120mil):1.5mm(60mil) | |
PCB Min. Punching Slot | FR-4 CEM-3 board thickness≤1. 0mm(40mil):0.8 mm×0.8 mm(32mil×32mil) |
FR-4 board thickness1.2-3.0mm(48-120mil): 1.0 mm×1.0 mm(40mil×40mil) | |
Trace width variation | ±0.076mm(±3mil) |
Outline Tolerance | Routing:±0.1mm (±4mil) ,Punching:±0.05mm (±2mil) |
V-CUT Registration Tolerance±0.2mm (±8mil) | |
PCB BOARD Type | Single-sided, double-sided, multi-layer |
Major Material | FR-4, CEM-1,CEM-3, high frequency laminates, Aluminum, NiFe-based, copper base |
PCB BOARD Thickness | 0.2-3.5mm |
Base Copper Thickness | 11um 35um 70um 105um |
Max. aspect ratio(board thickness: hole size) | 8:1 |
V-Cut Angle Tolerance | ±5° |
V-Cut Board Thickness | 0.4mm -3.2mm(16mil -128mil) |
Min SMT Pitch | 0.3mm(12mil) |
Min. Component mark | 0.15mm(6mil) |
Min. width of annular ring(finished) | 0.15mm(6mil)/side |
Min pad opening | 0.076mm(3mil) |
Min S/M Bridge | ±0.076mm(±3mil) |
carbon ink board manufacturing capability:1.Impedance Control:20K±10% 2.Hardness:6H 3.bearable friction times :above 200000 times |
NO. | Items | NO. | Items |
1 | Board for what product | 8 | Surface Finish |
2 | Number of Layers | 9 | Board Material |
3 | Copper Thickness(um) | 10 | Board Thickness(um) |
4 | Solder Mask Color | 11 | PCB Dimensions(mm) |
5 | Silk Screen Color | 12 | Min Finished Hole Size(mm) |
6 | Milling | 13 | Min Clearance(mm) |
7 | Min Track Width(mm) | 14 | Other special requirements |
Packaging | Vacuum Packing with desiccant, Professional Export Carton. |
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Delivery time |
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Prototype | Mass production (above 30m) |
2L | Quick turn:24h Usual time:3-4days |
5-10days | |
4L | Quick turn:48 hours; Usual time:5-6days |
10-15days | |
6L | Quick turn:72 hours; Usual time:6-8days |
10-20days | |
8L | Quick turn:72 hours; Usual time:8-10days |
15-22days | |
10L | Quick turn:96 hours; Usual time:12-14days |
18-25days | |
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