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UCREATE PCB CO., LTD.
Business units
ChinaVIP0Audited Supplier
Products: PCB Board , PCB / Aluminum PCB , Printed Circuit Board / Circuit Board , LED PCB / LED Strip / Light PCB , PCBA / PCB Assembly , OEM PCB / MCPCB , Multilayer PCB / Fr4 PCB , Flexible PCB / FPC , SMT Assembly / PCB Layout , PCB Manufacturers / Electronics
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3step Flex-Rigid PCB Board for Computer
Basic Info
Model NO.: DRH67
$0 /Piece
Product Details
Transaction Comments
Basic Info
- Model NO.: DRH67
- Dielectric: Polyimide&Fr4
- Application: Computer
- Processing Technology: Electrolytic Foil
- Base Material: Polyimide&Fr4
- Brand: Uc
- Thickness: 1.35mm
- Surface: Enig
- Transport Package: Vacuum Package
- Origin: Shenzhen, China
- Structure: Rigid-Flex
- Material: Polyester Glass Fiber Mat Laminate
- Flame Retardant Properties: V0
- Production Process: Subtractive Process
- Insulation Materials: Epoxy Resin
- Layer: 4
- Min Hole: 0.3mm
- Trademark: UC
- Specification: UL(US&Canada). ISO. RoHs, TS, SGS
- HS Code: 8534009000
Product Description
Parameters
Layers: 4L (3F+1R)
Thicknes: 1.35±0.14mm
Min. Hole Size: 0.30 mm
Width/Space: 0.12 mm/0.13 mm
Surface Treatment: ENIG
Crafts
3F+1R Rigid - flexible Board
Applications
Military project
Ucreate LTD PCB's aim
Customer Satisfaction is Always Our First Priority!
*Quality Policy
*Top Quality and high efficiency
*Improve continuously
*Achieve customer's satisfaction
1.Products Application
2. Market Distribution
3.Technical Capabilities
| Items | Speci. | Remark | |
| Max panel size | 32" x 20.5"(800mm x 520mm) | ||
| Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | ||
| Min PAD (inner layer) | 5 mil(0.13mm) | hole ring width | |
| Min thickness(inner layer) | 4 mil(0.1mm) | without copper | |
| Inner copper thickness | 1~4 oz | ||
| Outer copper thickness | 0.5~6 oz | ||
| Finished board thickness | 0.4-3.2 mm | ||
|
Board thickness tolerance control |
±0.10 mm | ±0.10 mm | 1~4 L |
| ±10% | ±10% | 6~8 L | |
| ±10% | ±10% | ≥10 L | |
| Inner layer treatment | brown oxidation | ||
| Layer count Capability | 1-30 LAYER | ||
| alignment between ML | ±2mil | ||
| Min drilling | 0.15 mm | ||
| Min finished hole | 0.1 mm | ||
| Hole precision | ±2 mil(±50 um) | ||
| tolerance for Slot | ±3 mil(±75 um) | ||
| tolerance for PTH | ±3 mil(±75um) | ||
| tolerance for NPTH | ±2mil(±50um) | ||
| Max Aspect Ratio for PTH | 8:1 | ||
| Hole wall copper thickness | 15-50um | ||
| Alignment of outer layers | 4mil/4mil | ||
| Min trace width/space for outer layer | 4mil/4mil | ||
| Tolerance of Etching | +/-10% | ||
| Thickness of solder mask | on trace | 0.4-1.2mil(10-30um) | |
| at trace corner | ≥0.2mil(5um) | ||
| On base material |
≤+1.2mil Finished thickness |
||
| Hardness of solder mask | 6H | ||
| Alignment of solder mask film | ±2mil(+/-50um) | ||
| Min width of solder mask bridge | 4mil(100um) | ||
| Max hole with solder plug | 0.5mm | ||
| Surface finish | HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. | ||
| Max Nickel thickness for Gold finger | 280u"(7um) | ||
| Max gold thickness for Gold finger | 30u"(0.75um) | ||
| Nickel thickness in Immersion Gold | 120u"/240u"(3um/6um) | ||
| Gold thickness in Immersion Gold | 2u"/6u"(0.05um/0.15um) | ||
| Impedance control and its tolerance | 50±10%,75±10%,100±10% 110±10% | ||
| Trace Anti-stripped strength | ≥61B/in(≥107g/mm) | ||
|
bow and twist |
0.75% | ||
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